HEADLINES ARCHIVE
METCASE’s wall-mount enclosures are ideal for today’s HMI systems
These modern aluminum enclosures are perfect for factory processing, security, machine control, measurement and detection.
Stylish MOTEC desktop enclosures now with carry handle and sloping front panel
The enclosures are ideal for measuring and control, peripherals, interfaces, switchboxes, modems, laboratory equipment and medical/wellness devices.
OKW’s ROBUST-BOX IP 66 plastic enclosures now in tough polycarbonate
The enclosure offers a high resistance to heat for use in adverse environments.
Pico Technology announces major upgrade to PicoScope 7 software with release of version 7.2
The update introduces powerful new features and enhancements designed to improve waveform capture, analysis and measurement confidence.
Now available — Modelithics Qorvo GaN Library v25.5.
This release includes compatibility with Keysight Technologies’ Advanced Design System (ADS) 2026 as well as Cadence AWR Design Environment v25.1.
Two versions of ROLEC’s handCASE for machine control, robotics and defense electronics
These rugged diecast aluminum enclosures are ideal for industrial and military applications in which devices must survive challenging environments but also be comfortable to hold for long periods.
Next generation surface treatment with atmospheric pressure plasma
Discover how Plasmatreat's Openair-Plasma technology provides surface treatment solutions that meet the strict demands of modern manufacturing.
Now available: Modelithics COMPLETE Library v25.7 for Cadence AWR design environment
This release includes new Microwave Global Models for capacitor, resistors and inductors from Amotech, Coilcraft, International Manufacturing Services, Kyocera-AVX and Passive Plus.
Column: In AI, local democracy finds an unlikely ally
Concerned citizens – perhaps too busy to get themselves to a public hearing at city hall – are now being offered other options to get their viewpoint heard. And in those communities, AI is becoming something of an equalizer.
ROLEC announces its latest diecast enclosures for defense electronics
These IP-rated diecast enclosures are suitable for electronics in tracked and wheeled vehicles, warships and fleet auxiliaries, training/simulation technology, military cranes and railways used for troop transport, logistics and supply.
Indium Corporation is electrifying the future with advanced materials solutions at Productronica
The company will present its solder paste alloy and other advanced materials solutions for power device packaging and electronic assembly.
Universal enclosure feet kits now in four standard colors
These universal case feet are designed to fit all types of metal and plastic enclosures from METCASE and other manufacturers.
Indium Corporation expert to present on solder paste solutions at SMTA Empire Expo and Tech Forum
The focus will be on solder paste selection, storage and handling best practices for printed circuit board assembly.
Extra space and accessories for OKW’S SOFT-CASE wide-format handheld enclosures
Accessories for OKW’s SOFT-CASE wide-format handheld enclosures now include intermediate rings that create extra space for components.
Fueling fusion at room temperature
The effect of electrochemical loading on nuclear fusion reaction rates at room temperature was explored.
OKW offers more enclosures and knobs for HVAC, climate control and environmental technology
These components are engineered to withstand a range of hazards including temperature fluctuations, particles, low-level vibration and cleaning with aggressive chemicals.
Solar cells capture the light indoors
New perovskite solar cells are capable of efficiently harvesting energy from indoor light.
Indium Corporation to showcase innovative materials enabling AI technology at SEMICON Taiwan
Learn how these heterogeneous integration and assembly products and thermal interface materials are enabling artificial intelligence (AI) innovation.
Recycled water cools the data center cloud
Amazon plans to tap recycled water to cool more than 120 U.S. data centers by 2030.
Reliability in electronics through informed material choices
Discover methods to easily incorporate synergistic materials that prevent material compatibility-related failures in both semiconductor and PCB fabrication and assembly.