HEADLINES ARCHIVE
Thermally conductive adhesives and potting compounds
Thermally conductive adhesives and potting compounds offer a wide array of properties tailored to meet diverse requirements.
Driving sustainability and performance in semiconductor manufacturing: Material solutions for the future
Sinter pastes and other materials developed by MacDermid Alpha eliminate the presences of PFAS in semiconductor manufacturing while ensuring excellent thermal and electrical conductivity.
Micro hook solving testing challenges in small environments
E-Z-Hook’s X2015 micro double gripper test connector was developed to address test and measurement challenges of the ever-changing test and measurement field.
The importance of isolated signal conditioners in protecting sensors and measurement equipment
Connecting a physical sensor to a data acquisition system is a serious undertaking.
Turning data into action: Leveraging AI and edge devices for manufacturing optimization
Learn how to create an actionable roadmap to enable artificial intelligence (AI), digital twins and edge computing to optimize manufacturing environments in the world of Industry 4.0.
I want candy
Just as candy concoctions require unique ingredients, so do cables specified for unique electrical environment applications.
Tackling the space junk crisis: On-orbit servicers
There are approximately 3,000 derelict satellites in orbit right now, but fixing them is cheaper than launching new. Here's how engineers are helping on-orbit service satellites deal with unpredictable targets.
ROLEC’s technoBOX (IP 66) plastic enclosures — Now with more accessories
The enclosures can now be specified with front plates, hinges, case feet, mounting plates, supporting rails, cable glands and external mounting brackets.
TapX MTC — ANCA’s patented Motor Temperature Control (MTC) technology
The technology enables the production of consistently high-quality taps by addressing a key challenge — thermal growth.
A new path to board-level reliability
Discover how MacDermid Alpha’s reliability enhancement tool provides a head start into a larger journey along the path to board-level reliability.
Servomotors feature integrated water cooling
With integrated water cooling, the series achieves an extremely high power density, allowing it to deliver up to 40 kW of power within a very compact space.
Watch a smartphone morph into a microscope
This inexpensive and powerful device converts any smartphone into a high-resolution microscope.
Rosenberg wins AHR Expo 2025 Innovation Award with new AMCA-certified I-series fans
The award-winning fan increases airflow and energy efficiency, while greatly reducing noise.
OKW’s TOPTEC universal enclosures: Perfect for PCBs with protruding connectors
These enclosures allow PCBs with protruding connectors and interfaces to be mounted directly into the case.
Altech enclosures for harsh environments quick chat
In this quick chat, Jeff Roye and Bob Vavra discuss Altech's industrial enclosures.
Elegant TECHNOMET instrument enclosures now offer more handle options
These desktop instrument enclosures can now be specified without a handle, or with recessed side handles or a tilt/swivel bail arm.
Delivering 3D IC innovations faster
Learn how to use the Siemens heterogeneous 3D IC solution to create designs that meet or exceed PPA goals and improve the differentiation, profitability and time to market of the next market-leading project.
A no-brainer solution for compact cooling applications
Frameless fans are smaller and lighter than their framed counterparts and can be mounted in a wide range of configurations to combat heat buildup in electronics and other machinery.
Medical grade UV adhesive bonds TPUs
See how thermoplastic polyurethanes (TPUs) are bonded with this medical grade UV adhesive.
Optical water analyzers for critical measurement in real time
The system includes optical sensors, controllers, a suite of add-on accessories and a data analytics and software solution.