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Heterogeneous Packaging Design and Verification Workflows Thursday, May 26, 2022

The need for innovative packaging technologies to support system scaling demands and achieve lower system cost is driving an emerging trend to discrete, unpackaged ASIC devices, otherwise known as chiplets. These chiplets are mounted and interconnected into a single package using high speed/bandwidth die-to-die (D2D) interfaces that can deliver monolithic or greater functionality and performance, with reduced power and cost. This webinar outlines the high-level workflows required to support the design and verification of a heterogenous integration (HI) system in package (SIP) designs.

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