Electronics

HEADLINES ARCHIVE

  • Gantner Instruments releases GI.bench 2025 update: 20 times faster data, smarter testing

    The new release delivers up to 20 times faster data throughput, streamlined configuration and enhanced automation, helping engineers complete test setups in less time while capturing higher-quality data.

  • Humanoid robots are tripping over their high energy demands

    Battery science, overall system weight, thermal management needs and actuator efficiency all contribute to a power-hungry android with limited energy reserves.

  • Igus to showcase affordable palletizing cobot at PACK EXPO Las Vegas 2025

    The Fairino FR20 features a robust 20 kg payload capacity and 1,854 mm reach with six degrees of freedom.

  • OKW offers more enclosures and knobs for HVAC, climate control and environmental technology

    These components are engineered to withstand a range of hazards including temperature fluctuations, particles, low-level vibration and cleaning with aggressive chemicals.

  • Modular, hybrid, adaptable: Connectors get flexible

    The trend in consumer electronics tends to be all-in-one packages that minimize the potential for user interference. But for many platforms and systems, a more modular approach and multi-function components is still essential.

  • AGILOX heads west, debuts new AMR at PACK EXPO Las Vegas

    The event will see the North American launch of the new AGILOX OFL, an omnidirectional autonomous stacker that handles loads up to 800 kg/1,760 lbs and lifts them up to 1.2 m/ 47 in.

  • Indium Corporation to showcase innovative materials enabling AI technology at SEMICON Taiwan

    Learn how these heterogeneous integration and assembly products and thermal interface materials are enabling artificial intelligence (AI) innovation.

  • Emerson HMI/SCADA software adds features to optimize connectivity, development and run-time performance

    The platform offers performance and user-centric advancements for communications, scripting, development efficiency, data management and security.

  • More standard colors for METCASE'S UNIDESK sloping-front enclosures

    These desktop and wall-mount aluminum enclosures are now available in black, light gray and new traffic white.

  • Emerson announces 2025 Discrete Automation Scholarship recipients

    The scholarship program recognizes exceptional undergraduate and graduate students pursuing careers in science, technology, engineering and math (STEM).

  • Tips for calibrating large-scale sensor networks

    As sensor deployments scale into the hundreds, the manual effort and cost of calibration multiplies very rapidly, making manual and component level interventions increasingly costly.

  • Comprehensive training from NORD Drivesystems equips customers for success

    NORD expands its training programs with in-person, online and customized sessions designed to provide customers with in-depth knowledge of its mechanical and electronic drive solutions.

  • Reliability in electronics through informed material choices

    Discover methods to easily incorporate synergistic materials that prevent material compatibility-related failures in both semiconductor and PCB fabrication and assembly.

  • ROLEC’s tough conTROL enclosures with built-in RFI/EMI shielding

    The diecast aluminum enclosures with shielding are designed primarily for machine control in challenging environments.

  • Q&A: A deep dive into pSemi's supercharged portfolio

    The latest semiconductor platform update that represents 16 generations of advancements in RF SOI technology.

  • Column: What it takes to secure the networks of the automation revolution

    Even once organizations recognize OT security’s true importance, the journey to effective protection is a difficult one. According to Terence Liu, CEO of TXOne, "Simply transplanting IT solutions into OT can backfire.”

  • OKW’s STYLE-CASE handheld enclosures: More accessories for improved functionality

    Accessories for these electronics enclosures now include wall holders, sealing kits, battery clips, strain relief and a flexible Ø 5.3 mm black grommet to protect cable connections.

  • Ellsworth Adhesives collaborates with 3M to distribute one-part electronics epoxy enabling smaller, stronger devices and faster production

    These innovative solutions for bonding and sealing are poised to help expand electronic design capabilities and manufacturing efficiency worldwide.

  • Data centers are overheating — And so are their utility bills

    Discover how smarter flow measurement with electromagnetic flow meters can help data centers stay efficient, sustainable and cool under strain.

  • Q&A with Szymon Chawarski, of Teledyne Vision Solutions, on AI-powered machine vision and Automate 2025

    GlobalSpec recently had the opportunity to ask Szymon Chawarski, product line manager at Teledyne Vision Solutions, about the growing role of AI in machine vision systems and cameras. Chawarski is the perfect person to ask.

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