Watch how this die attach epoxy is dispensed
September 11, 2023Master Bond EP3HTSDA-2 is a silver filled epoxy adhesive system that may be used in applications where thermal management is needed. It is a one component system, with an unlimited working life at room temperature. It has a high-thermal conductivity of 45–49 BTU•in/(ft²•hr•° F) [6.5-7.0 W/(m•K)] and can be applied in ultra-thin bond lines. Most importantly, EP3HTSDA-2 exhibits very low thermal resistance of 2–3 x 10 –6 K•m2/W. It also has outstanding electrical conductivity with a volume resistivity less than 0.001 ohm–cm.
EP3HTSDA-2 meets NASA low outgassing specifications and is serviceable from -80° F to +450° F (-62° C to +232° C). It adheres well to both similar and dissimilar substrates such as aluminum, ceramic, copper, fiberglass, polyimide and silicon die. This formulation is designed to cure in 20–30 minutes at 250° F or 5–10 minutes at 300° F. Die shear strength has a 20–20 Kg-f value at 75° F measured for a die size of 2 x 2 mm (80 x 80 mil).
