How to use EP4EN-80 for potting and encapsulation applicationsAugust 31, 2021
Master Bond EP4EN-80 is a NASA low outgassing approved epoxy. Unlike conventional one component heat curing systems, this epoxy can cure at temperatures as low as 80° C. It features a quick cure profile at 65° C for 90 minutes plus 30 minutes at 80-85° C. When used as an adhesive, EP4EN-80 can be applied in thicknesses as thin as 10-15 microns. Free flowing EP4EN-80 is suitable not just for bonding, but also for small potting and encapsulations up to about a ¼ inch thick in some applications. Due to its ultra fine particle size filler material, this system offers unique gap filling and heat transfer capabilities. It is a no mix system, with a very low viscosity of 600-1,800 cps. EP4EN-80 maintains excellent thermal conductivity and electrical insulation properties upon curing. It also offers an impressive strength profile.