Master Bond FL901AO is a one part, thermally conductive film for high performance bonding and sealing. In this video, we demonstrate how easy it is to use an epoxy based film system, with step by step instructions.

FL901AO is a die attach adhesive that has convenient handling and storage stability. It is available in sheets and performs. The standard size sheet is 6 in. x 2 in. by 0.003 in., although other sizes are available. One of the advantages of this film is the uniform bond line thickness it provides. The most commonly used bond line thicknesses in a bond joint fall between 0.001 and 0.007 in. so the 0.003 inch in the standard sheet is well within this range. Typically, a thin bond line is preferred over a thick one, since the stress concentration in the joint would be less with a thinner line. Uniformity of the bond line is also important to achieve optimal performance properties.

Other key performance properties of this system include electrical insulation and a high strength profile. The die shear strength measures 40 to 45 kg-f and the tensile modulus is greater than 350,000 psi. It withstands thermal cycling and is serviceable from -100 F to 400 F.

The film is a light gray color, located between two pieces of release paper. As demonstrated in the video, to use the film, the release paper is removed from the lower part of the material and the film is applied to the first substrate. The film will be slightly tacky, which allows it to attach to the substrate. The other layer of release paper is then removed to join the second substrate. It is suggested to apply light pressure to the substrates. The assembled unit would then be placed in the oven for curing at 250 F for 1 hour or at 300 F for 40 to 45 minutes. FL901AO bonds well to a wide variety of substrates including metals, composites, glass, ceramics and plastics. It is recommended for use in aerospace, electronics, electrical and specialty OEM applications where thermal conduction and electrical insulation are required.