Master Bond FLM36 is a high temperature resistant B-staged adhesive film that features thermal conductivity and electrical insulation. In this video, we demonstrate how easy it is to use with step by step instructions.

This product eliminates the need for mixing and measuring and is easy to handle. It is used for bonding and sealing applications in the aerospace, electronic, opto-electronic and specialty OEM industries. FLM36 can withstand high temperatures up to 500° F and retains its high strength properties upon prolonged exposure to elevated temperature. It bonds well to a variety of substrates including metals, composites, glass and many plastics.

Unlike other heat resistant epoxy systems, FLM36 has more flexibility and toughness, which enables it to endure thermal and mechanical shocks as well as thermal cycling. It also provides good chemical resistance to water, acids, bases, fuels and oils.

The film has release paper on each side. After the substrates to be bonded are properly prepared, the release paper is removed to expose the adhesive. It is then carefully placed onto the part and pressure is applied. The assembly is lightly fixtured and cured for 1-2 hours at 350° F. The bonded parts should be returned to 75° F before removing the fixtures.

FLM36 offers uniform bond line thickness and limited squeeze out during bonding.

It is offered in three standard sizes: FLM36-4A is 4 x 4 x 0.008 in, FLM36-8B is 8 x 8 x 0.008 in and FLM36-12C is 12 x 12 x 0.006 in. The film can be cut with a pair of sharp scissors into various shapes and sizes. The films are rugged, durable and not prone to cracking. Contrary to most thermoset films of this type, FLM36 does not require freezing or refrigeration.