Kyocera Corporation has developed an ultra-small ceramic package utilizing a proprietary multilayer structure with a built-in RFID antenna that can increase the read range up to 2X as compared with conventional packages of the same size.

Kyocera’s proprietary technologies cultivated over many years in advanced ceramic materials and multilayer structures ensure a compact package with outstanding performance. The new ceramic package with an RFID antenna will help meet rising demand for RFID tags to support Internet of Things (IoT) applications.

Product Features:

  • Up to 2X communication distance in the UHF band while maintaining a compact size. Even as package size decreased, the Kyocera low-profile thin multilayer cavity structure continued to outperform the conventional RFID tags of similar outlines.
  • LTCC material offers excellent high-frequency properties and high flexural strength. The packages take advantage of the low-loss and high-frequency benefits of Low Temperature Co-fired Ceramic (LTCC), yet deliver the high flexural strength expected from High Temperature Co-fired Ceramic (HTCC).
  • Cavity structure for IC chip protection and ultra-small tag design.
  • Suitable for metallic products, opening new potential uses in automotive, factory automation, healthcare and many other fields.