Thinfilm Electronics, a Norwegian maker of printed electronics and near field communication (NFC) smart packaging, has leased a former Qualcomm-owned manufacturing facility in Silicon Valley and will relocate its current United States headquarters and NFC Innovation Center during the first quarter of 2017.

The location will house Thinfilm’s high-volume, roll-to-roll manufacturing line. Roll-to-roll processing, also known as web processing, is the process of creating electronic devices on a roll of flexible plastic or metal foil. Roll-based production will increase Thinfilm’s front-end production capacity to five billion NFC OpenSense and NFC SpeedTap tags per year, which could mean up to $680 million in annual revenue. Thinfilm says it intends to begin ordering line-related equipment immediately.

In the near term, the facility upgrade will allow Thinfilm to scale existing sheet-based manufacturing of its NFC, EAS (electronic article surveillance) and sensor label products. The company says it expects its roll-to-roll production to be operational for EAS by the end of 2017 and transistor-based products to start manufacturing in 2018.

Thinfilm’s NFC smart labels allow brands to address authentication and anti-tampering needs while also letting consumers engage with the brands by tapping an Android smartphone.

To contact the author of this article, email engineering360editors@globalspec.com