EP4S-80 has an unlimited working life at room temperature and a moderate heat cure requirement of 80° C. With a viscosity of 10,000–15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI shielding and static dissipation. This formulation can also be used in a variety of applications where electrical conductivity is required: bonding, sealing and coating, as well as gap filling and encapsulating.

EP4S-80 features excellent mechanical properties with a tensile modulus of 500,000–600,000 psi and a compressive strength of 22,000–24,000 psi at 25° C. This electrically conductive system offers a volume resistivity of 0.02–0.06 ohm-cm and a thermal conductivity of 1.30–1.44 W/(m•K). Upon curing, EP4S-80 offers low shrinkage, excellent dimensional stability and a glass transition temperature of 130–135° C. Serviceable over the temperature range of -60° C to +150° C [-75° F to +300° F], this compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials and many plastics. It is packaged in ounce and pound jars.

Watch this video to see how this low viscosity compound can be dispensed through a syringe or brushed on to create a protective coating.