Master Bond EP4S-80 is a one component, silver filled epoxy for bonding, sealing and coating. It is low in viscosity and flows smoothly and easily. This epoxy requires heating at 80° C for 60 to 90 minutes for curing. This epoxy has no solvents or diluents, and very low shrinkage upon curing.

EP4S-80 bonds well to a wide variety of substrates such as metals, ceramics, composites and many plastics. It is a high modulus, high compressive strength system. Its electrical conductivity is excellent, with a volume resistivity less than 0.001 ohm–cm. The epoxy has good dimensional stability. EP4S-80 fits very nicely in bonding, sealing and gap-filling applications, including lid and chip attachment, microelectronics, semiconductor packaging and EMI/RFI shielding. It can also be considered for specialty encapsulation applications where electrical conductivity is needed. This system resists water, oils and fuels. The service temperature range is -60° C to +150° C. EP4S-80 should be considered in a broad array of applications including electronics, acoustical, automotive systems, PCB assembly where a one-part, low viscosity, highly electrically conductive epoxy is needed.

EP4S-80 is available in both syringes and jars. Syringes are shipped in dry ice, stored in a cryogenic freezer, and packaged for one-time use. Upon thawing, it is recommended to use the syringe within 6 hours, and any remaining material then be discarded. When packaged in jars there are no shipping restrictions. Upon arrival, the jar is stored in a refrigerator and best used within a 12-hour time frame, with occasional stirring to prevent the silver filler from settling out. Jars then should be returned to the refrigerator for reuse.