Fujipoly has introduced a new line of two-component thermal gap fillers that also exhibit excellent electrical insulative properties. The SARCON LG series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance.

SARCON LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be Source: Fujipolydramatically accelerated with exposure to temperatures up to 100° C. The mixed components cure into a flexible gel that is highly thermally conductive while exhibiting extremely low stress on delicate board components. Once cured, the materials deliver a thermal conductivity of 2.3 and 3.0 W/m° K respectively.

LG series materials are available in cartridges, pails and drums allowing them to be applied by hand or automated dispensers.