Fujipoly recently released the SARCON GR100A series, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.05 K-in²/W at 72.5 PSI with a thermal conductivity of 10 W/m°K.

SARCON GR100A is available in five thicknesses (0.3 mm, 0.5 mm, 1.0 mm, 1.5mm and 2.0 mm) up to aSource: Fujipoly maximum dimension of 300 mm x 200 mm and can be die-cut to fit almost any application shape. This new Fujipoly thermal interface material is well-suited for environments with operating temperatures ranging from -40° C to 150° C.

When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance.