Sarcon 30XR-m from Fujipoly is a high-performance thermal interface material that exhibits a low thermal Source: Fujipolyresistance. The 0.3 mm thick TIM is available in dimensional sheets up to 200 mm × 150 mm or can be die-cut to fit your exact application shape.

When placed between a heat source such as a semiconductor and a nearby heat sink, Sarcon 30XR-m provides a thermal conductivity of 17.0 W/m•K and a thermal resistance of only 0.30° C•in2/W.

The silicone-based material completely fills air gaps between uneven components, board protrusions, and recessed areas. This increases surface contact with the heatsink, thereby improving overall cooling performance.