Master Bond’s dual curing compounds cure both upon exposure to UV light and upon exposure to heat. These adhesives, sealants and coatings are applied to assemblies where complete UV curing is either too difficult or impossible to achieve, such as applications with complex geometries and concealed, "shadowed out" areas.

UV + Heat dual curing products reach full cure with UV energy, heat energy or both. The UV cure reduces fixturing time while heat ensures complete cure throughout the bond line, especially for areas not accessible to UV light. The thermal cure is typically initiated at temperatures as low as 80° C (176° F) which opens new opportunities for thermally sensitive substrates. These features make them ideal for applications including but not limited to electronic assemblies and 3D printing.

These products are available in a wide range of viscosities, and they exhibit high bond strength with glass, metals, ceramics and many plastics. They offer easy application and incredibly fast cures. The exposed areas of dual curing adhesives can cure in a few seconds when UV light is applied and the shadowed out areas cure in about 20 to 30 minutes upon exposure to heat. Specific grades may meet USP Class VI for biocompatibility and/or the ISO10993-5 test requirements for cytotoxicity. Other formulations may be nano-silica filled, meet NASA low outgassing requirements, provide excellent dimensional stability and lower shrinkage relative to other UV/Dual curing chemistries.

In this video, you’ll see an illustration depicting a dual curing adhesive that uses both UV light, as well as heat for curing. Learn more about how this type of adhesive can be utilized in your application.