MacDermid Alpha Electronics Solutions, a provider of specialty materials for electronics, has released MacuSpec VF-TH 300 as a new addition to its VF-TH series electroplating processes widely utilized in modified semi-additive processing (mSAP) high density interconnector (HDI) manufacturing.

As the 5G standard is growing outward from the highest tier smartphones, board manufacturers of these devices need to increase high density layers beyond the capability of regular HDI and into the realm of more difficult to build mSAP. The MacuSpec VF-TH 300 is a single step pattern plating process for the simultaneous copper filling of blind microvias and plating of through holes while providing controlled trace profiles in mSAP applications. The innovative process deposits an electrolytic copper layer that is naturally resistant to a Source: MacDermid Alpha Electronics Solutionsphenomenon called V-pitting which can occur during the final etching process. V-Pits are a reliability concern currently addressed with an annealing process that involves baking the boards after plating for several hours.

With the VF-TH 300, customers can now utilize a shortened bake or skip the bake entirely and achieve V-pit free results, improving quality and increasing production throughputs. The process does not require a predip or flash plate and is completely analyzable by CVS for ease of process control.

MacuSpec VF-TH 300 can be plated directly onto low etch direct metallization technologies like Blackhole LE and Eclipse LE. This leverages improvements in copper etch budget and elimination of palladium activation, electroless copper and flash plating while increasing quality and reducing costs. When these innovations are combined with the soon-to-be released CircuEtch 200, a high-performance anisotropic final etch, the result is mSAP with higher yields and ease of manufacturing for the next generation of smartphones and other mobile devices.