Fujipoly recently released Sarcon® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02 °C/in²/W at 43.5 psi with a thermal conductivity of 13 W/m° K.

Sarcon® GR130A is available in five thicknesses (0.3, 0.5, 1.0, 1.5 and 2.0 mm) up to a maximum dimension Source: Fujipolyof 300 mm x 200 mm and can be die-cut to fit almost any application shape. This new Fujipoly thermal interface material is well-suited for environments with operating temperatures ranging from -40 to 150° C.

When placed between high-power, heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance.