Researchers at Michigan State University College of Engineering are working with technology known as substrate computing. This will allow sensing, communication and diagnostic computing all within the substrate—the building material—of a structure. The technique will operate on energy harvested from the structure itself. The tiny microchips are self-powered and use a new sensor-network technology to communicate. Image Credit:Wireless Networks Sensors

With this technology, a bridge or a dam could sense a structural defect before it happens, diagnose what the problem will be and alert authorities, reports Wireless Sensor Networks magazine.

The head of the research team and professor of electrical and computer engineering, Subir Biswas, says, “Adoption of such monitoring has previously been limited because of the frequency of battery replacement for battery-powered sensors." A second limiting factor has been the need for a separate communication subsystem usually involving radio frequency sensor networks.

The research team is focusing its work in the area of smart modular substrates with embedded sensing, communication and computing. These use advancements in mechanical energy harvesting and ultrasound communications.

The goal is to integrate all these functions within a 3 millimeter-by-3 millimeter electronic chip, which can be embedded within the material of a structure.