Fujipoly has introduced Sarcon PG45A, its newest high-performance, putty-like thermal interface material. Source: FujipolyThis extremely low modulus gap filler exhibits a thermal resistance as low as 0.02° C/in²/W at 43.5 PSI with a thermal conductivity of 4.5 W/m° K.

Sarcon PG45A requires very low compression force at high compression rates making it a great choice for applications that have delicate or wide-variation component heights requiring material compression up to 70% to 90%.

PG45A is available in three sheet thicknesses (1.5, 2.0 and 2.5 mm) up to a maximum dimension of 300 mm x 200 mm. Sarcon PG45A can also be ordered in die-cut form to fit almost any application shape and is well-suited for environments with operating temperatures ranging from -40° C to 150° C.