The compression characteristics of thermal gap fillers should be key considerations during a product’s early Source: Fujipoly America Corporationdesign phase. For applications that have delicate components or widely varying gap distances, Fujipoly created a line of low compression force gap filler pads. These thermal insulating materials help avoid overstressing the printed circuit board (PCB) and fragile solder joints as the interface material is compressed between the heatsink and board-level components during assembly.

To accommodate broad-ranging applications, Fujipoly offers several low compression force Sarcon materials that exhibit compression forces less than 15 PSI, depending on thickness. Thickness options range from 1.00 mm to 5.00 mm with thermal conductivity between 1.5 and 2.8 W/m•K.

Fujipoly technical support is available to help determine the best material for an application. We can quickly analyze the relationship between gap size, material thickness, compression and contact resistance.