Sarcon PG80A is an extremely compressible, high-performance thermal interface material. This advanced putty-Source: Fujipolylike, gap filler pad exhibits a thermal resistance as low as 0.08° C/in²/W at 14.5 PSI with a thermal conductivity of 13 W/m° K.

Sarcon PG80A requires very low compression force at high compression rates, making it a great choice for applications that have delicate or wide-variation component heights requiring material compression between 30% and 90%.

PG80A is available in four sheet thicknesses (0.5, 1.0, 1.5 and 2.0 mm) up to a maximum dimension of 300 mm x 200 mm. Sarcon PG80A can also be ordered in die-cut form to fit almost any application shape and is well-suited for environments with operating temperatures ranging from -40° C to 150° C.