In this video demonstration, learn more about the unique performance properties of nanosilica filled epoxy EP30NS.

Master Bond EP30NS is a two-component epoxy system that cures at room temperature or more rapidly at elevated temperatures. It is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. EP30NS offers dimensional stability, linear shrinkage of less than 0.01%, and excellent physical strength characteristics. It provides a rigid cure. Most significantly, this epoxy system has been independently tested per ASTM D4060-14 for abrasion resistance for 1,000 cycles and exhibited a loss of weight of only 18.3 mg. This value exceeds typical epoxy compositions and demonstrates the compound’s ability to withstand exposure to scuffing, gouging, scraping, scratching and wear.

“Master Bond EP30NS has a Shore D hardness of 80-90,” says Rohit Ramnath, Senior Product Engineer. “It possesses a coefficient of thermal expansion of 30-35 x 10-6 in/in/°C and is well suited for small potting applications. Its long term electrical insulation characteristics are quite impressive. Also noteworthy is that EP30NS has a tensile strength of 9,000-11,000 psi and a refractive index of around 1.56 at 589 nm.”