Nanosilica filled, dual cure adhesive meets NASA low outgassing specificationsMarch 03, 2021
Master Bond UV22DC80-1 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating with the ability to cure under UV light and/or with heat. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 mW/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with the addition of heat at 80° C for 40-60 minutes. This advantageous low temperature is useful when working with plastics or other heat sensitive substrates.
UV22DC80-1 is optically clear with a refractive index of 1.52 and passes NASA low outgassing testing per ASTM E595. It is a competent electrical insulator and features a volume resistivity exceeding 1014 ohm-cm. These properties make this compound well suited for high tech applications in aerospace, optical, optoelectronics and related industries.
As a nanosilica filled system, UV22DC80-1 delivers superior abrasion resistance, low shrinkage upon cure and dimensional stability. It bonds well to a wide variety of substrates, including metals, glass, ceramics and many plastics. UV22DC80-1 is a high strength product featuring a tensile strength of 6,000-8,000 psi. This system also resists chemicals such as acids, bases, fuels and solvents.
UV22DC80-1 has a service temperature range of -60° F to +350° F [-51° C to +177° C]. It can also withstand rigorous thermal cycling. This system has a glass transition temperature of 90° C, which can be increased to over 125° C if post cured at 125-150° C for 15-30 minutes. UV22DC80-1 is available for use in standard packaging in sizes ranging from half pints to 5 gallon containers and in convenient syringe dispensers.