Ironwood Electronics has introduced a new BGA socket addressing high-performance requirements for Micro Controller Units. The contractor is a stamped spring pin with 31-gram actuation force per ball and cycle life of 125,000 insertions.
The self-inductance of the contractor is 0.88 nH, insertion loss <1 dB at 15.7 GHz and contact resistance is <30mOhms. The current capacity of each contactor is 4 amps at 60 degrees Celsius temperature rise. Socket temperature is minus 55 degrees Celsius to ±180 degrees Celsius. The socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the CBT-BGA-6071 is a BGA, 17x17 mm, 0.8 mm pitch, 293 positions, 20 x 20 ball array. The socket is mounted using supplied hardware on the target PCB with no soldering and uses the smallest footprint for nearby passive components.
The socket uses a 5 post stiffener plate to support the backside of the PCB and allows passive components to be placed in between posts. This socket utilizes a clamshell lit with an integrated compression mechanism. To use this, place the BGA device into the socket base and close the clamshell lid assembly on the base using the latch. Turning the compression screw handle applies downward pressure via the integrated compression plate. The socket can be used for hand test and temperature characterization, as well as debugging an application in development and MCU comparison between various manufacturers.